The TIP Electronics Group provides flexible solutions, on a global basis, to optimize the utilization and reduce the cost of equipment ownership throughout the lifecycle. TIP segments the lifecycle into procurement, utilization and recovery phases. During each phase, TIP provides solutions intended to provide the customer with use of the right equipment, for the right period of time at the lowest all-in cost of use.

How We Help

Procurement

• Used Equipment Sourcing
• Equity Based Lending
• Hybrid Leasing Structures
• Short-Term Financing
• Rental Pools

Utilization

• Sale-Leasebacks
• Portfolio Management
• Equipment Tracking
• Technology Refresh
• Consulting

Recovery

• Remarketing Strategies
• Equipment Valuation
• Transaction Management

Equipment Markets Covered

Wafer Processing

• Lithography
  • Aligners
  • Steppers
  • Tracks
    
• Thin Films
  • PVD (Sputter)
  • Etch (all processes)
  • CVD
    
• Implant
  • High Current
  • Medium Current
  • High energy
    
• Metrology
  • SEM
  • Surface Analysis
  • Thickness Inspection

Automated Test Equipment ("ATE")

• Memory Testers
• Logic Testers
• Mixed Signal Testers
• Parametric Testers
• Handlers
• Probers

PCB Assembly

• Chip Shooters
• Feeders
• Glue Dispensers
• IC Placers
• Screen Printers

• China
• S.E. Asia
• Canada
• Western Europe

Office Locations

• Arizona
• California
• Michigan
• Asia
• Europe

Contacts

How We Can Help :: Markets :: International Coverage :: Contact Us
Office Locations :: Contacts :: Alliance Team :: Remarketing Database

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